Leading-edge LED Technology

Bridgelux is one of only three vertically integrated LED manufacturers in the United States. The Company progressively and actively invests in and develops new epitaxial processes, and these epitaxial technology advancements set Bridgelux’s high power LED Arrays and chips apart from others on the market. In addition, the Company’s investment in chip design technology has enabled Bridgelux to introduce new LED chips approximately every six months, with performance improvements in the range of 15 to 20 percent per introduction.

Bridgelux has a world-class team whose expertise in InGaN epitaxial growth processes, device structures, chip designs and LED packaging has enabled the Company to become a leader in the high power LED industry. The Company’s commitment to advanced R&D has yielded proprietary epitaxial technology and manufacturing processes, which together, create the high-quality foundation for its leading-edge LED Arrays and LED chips to deliver the right quality and quantity of light for solid-state lighting (SSL) applications.

To protect the Company’s technology advancements, Bridgelux is aggressively adding to its intellectual property (IP) portfolio, which includes approximately 100 patent applications filed or granted in the United States and 200 patent applications filed or granted worldwide.

Integrated Light Source Solution – LED Arrays
The family of Bridgelux LED Arrays has been developed with the end application in mind. Instead of following a component driven strategy, Bridgelux has defined product specifications targeted at the end system requirements for general lighting applications. These products have been optimized to deliver the performance necessary to displace high volume conventional light sources, while providing high quality uniform illumination, all with a focus on reducing the cost of light.

Bridgelux’s LED Arrays leverage the Company’s proprietary Metal Bond Technology (MBT), which reduces both thermal resistance and cost. This packaging technique has demonstrated a reduction in thermal resistance by 30-50 percent, as compared to LED solutions available on the market today. Bridgelux’s Metal Bond Technology eliminates redundant packaging steps and components, thereby reducing design complexity and manufacturing cost—which, in turn, accelerates time-to-market. Furthermore, lower thermal resistance is beneficial to the lighting system by increasing light output and reducing heat sinking requirements.

Advanced LED Chip Design
Bridgelux designs its own state-of-the-art, high power chips offering high light-extraction efficiency, good heat dissipation and excellent reliability. Bridgelux focuses on meeting these technical requirements, while minimizing cost and enabling high lumen per watt per dollar solutions.

Reactors & Epitaxy
Bridgelux has designed its own proprietary MOCVD reactors to grow the highest quality InGaN material. These custom reactors and proprietary epitaxial manufacturing processes are developed to continuously improve internal and external quantum efficiency of LED materials, thereby enhancing the quality, efficiency and cost-effectiveness of Bridgelux’s LED devices. This MOCVD capability is unique in the LED industry and sets Bridgelux apart from others in the SSL market.